in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.
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The heat is then removed from the chassis by external means. For example, if the circuit card modules are integrated first tested in a commercial, convection-cooled chassis in a laboratory environment and then installed into the actual chassis, then an extended width wedgelock would be used.
As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by from about 0. The embodiment illustrated in FIG. Wedgelock device for iieee thermal conductivity of a printed wiring assembly. Well this is a CompactPCI based article but it needs to be pointed out that VME based systems are used in a lot of applications developed for the military.
The heat efficiency ieeee this thermal path is directly affected by the clamping force exerted by wedgelock 3 i. Code s Theme s Certification of persons 11101.2 recognize your skills, register online to become certified. In particular, the adapter frame structure of the present invention is designed to allow the use of large wedgelocks, e.
It is contemplated, however, that certain 1110.2 applications would require the use of an extended width wedgelock and thus, it is shown for purposes of illustration. Affiliation List of ICS codes.
In fact if a system is not custom, based on a nonstandard backplane architecture, and if a 6U form factor can be used, then typically VME has been used.
IEEE Std IEEE Standard for Mechanical Core Specifications for – Google Books
An end portion of the circuit card 7 often includes a protrusion 4 often machined from base card 7which allows this module to be iree with a convection-cooled chassis as defined in IEEE Sensitive and rapid method for detection of low levels of LAL-reactive substances.
This, in turn, reduces the module to chassis interface temperature rise.
In the circuit card module of FIG. This article ieeee examine the typical conduction cooled environment as well as some of the design issues that are involved with developing conduction cooled product. May Number of pages: The analysis showed that the conventional design, as illustrated in FIG.
As clamping force is increased, the interface conductance is increased, thus increasing the efficiency of heat movement from the component 6 to the cold wall of chassis 2.
The reduction of thermal resistances and temperature rises is reflected in a reduced running temperature for component 6.
Conduction-Cooled PMC (CCPMC)
The present invention is compatible with the IEEE Conduction cooling allows the circuit boards to be sealed in the systems enclosure without requiring airflow. DIN EN remains valid alongside this standard until EP EPB1 en Please enter your name. The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG.
It is intended that the scope of the present invention be defined by the claims appended hereto. The particular values and configurations discussed above can be varied and are cited merely to illustrate a particular embodiment of the present invention and are not intended to limit the scope of the invention. Once this specification was available conduction cooled boards from different manufacturers could be used in the same system with no mechanical fit issues.
Conduction cooled CompactPCI boards ready for insertion
Your request to send this item has been completed. Add a review and share your thoughts with other readers. Thus, the surface contact area between the circuit card module is increased and the thermal performance improved without impacting the existing COTS design.